Method of manufacturing group III nitride crystal

Semiconductor device manufacturing: process – Formation of semiconductive active region on any substrate – Fluid growth from gaseous state combined with subsequent...

Reexamination Certificate

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C438S508000, C438S604000, C438S609000, C438S779000, C257SE21009, C257SE21097, C257SE21111, C257SE21131, C257SE29003

Reexamination Certificate

active

07863167

ABSTRACT:
Made available is a Group III nitride crystal manufacturing method whereby incidence of cracking in the III-nitride crystal when the III-nitride substrate is removed is kept to a minimum. III nitride crystal manufacturing method provided with: a step of growing, onto one principal face (10m) of a III-nitride substrate (10), III-nitride crystal (20) at least either whose constituent-atom type and ratios, or whose dopant type and concentration, differ from those of the III-nitride substrate (10); and a step of removing the III-nitride substrate (10) by vapor-phase etching.

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