Semiconductor device manufacturing: process – Formation of semiconductive active region on any substrate – Fluid growth from gaseous state combined with subsequent...
Reexamination Certificate
2011-01-04
2011-01-04
Lebentritt, Michael S (Department: 2829)
Semiconductor device manufacturing: process
Formation of semiconductive active region on any substrate
Fluid growth from gaseous state combined with subsequent...
C438S508000, C438S604000, C438S609000, C438S779000, C257SE21009, C257SE21097, C257SE21111, C257SE21131, C257SE29003
Reexamination Certificate
active
07863167
ABSTRACT:
Made available is a Group III nitride crystal manufacturing method whereby incidence of cracking in the III-nitride crystal when the III-nitride substrate is removed is kept to a minimum. III nitride crystal manufacturing method provided with: a step of growing, onto one principal face (10m) of a III-nitride substrate (10), III-nitride crystal (20) at least either whose constituent-atom type and ratios, or whose dopant type and concentration, differ from those of the III-nitride substrate (10); and a step of removing the III-nitride substrate (10) by vapor-phase etching.
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Nakahata Seiji
Sato Fumitaka
Judge James W.
Lebentritt Michael S
Sumitomo Electric Industries Ltd.
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