Semiconductor device manufacturing: process – Introduction of conductivity modifying dopant into... – Ion implantation of dopant into semiconductor region
Reexamination Certificate
2005-08-23
2005-08-23
Sarkar, Asok Kumar (Department: 2829)
Semiconductor device manufacturing: process
Introduction of conductivity modifying dopant into...
Ion implantation of dopant into semiconductor region
C438S302000, C438S514000, C438S525000, C438S530000
Reexamination Certificate
active
06933214
ABSTRACT:
Disclosed is a method of manufacturing a semiconductor device. A monoatomic dopant having a high atomic weight is implanted to form an ion implantation layer, instead of using a dopant of a small atomic weight such as B or a molecular ion such as a BF2in order to control the threshold voltage of the semiconductor device. Therefore, in an annealing process for mitigating damage caused by ion implantation, it is possible to limit TED (transient enhanced diffusion) of the dopant and prevent degradation of the film quality due to outgasing.
REFERENCES:
patent: 5605849 (1997-02-01), Chen et al.
patent: 6245639 (2001-06-01), Tsai et al.
patent: 6362059 (2002-03-01), Fukasaku et al.
patent: 6555484 (2003-04-01), Ramkumar et al.
Hynix / Semiconductor Inc.
Marshall & Gerstein & Borun LLP
Sarkar Asok Kumar
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