Method of manufacturing film carrier

Adhesive bonding and miscellaneous chemical manufacture – Delaminating processes adapted for specified product – Delaminating in preparation for post processing recycling step

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Details

29827, 156634, 156656, 1566591, 156902, 357 70, 437220, C23F 102, B44C 122, C03C 1500, C03C 2506

Patent

active

050045202

ABSTRACT:
There is provided a film carrier comprising a resin base film and a rolled copper foil laminated thereon, said rolled copper foil forming leads for mounting semiconductor chips or other electronic components in place, characterized in that said rolled copper foil is made of a copper alloy composition consisting essentially of a total of 0.005 to 1.5% by weight of one or two or more selected from a group consisting of

REFERENCES:
patent: 3728178 (1973-04-01), Caule
patent: 4719134 (1988-01-01), Ely
patent: 4731287 (1988-03-01), Noda et al.
patent: 4762747 (1988-08-01), Lier et al.
patent: 4764413 (1988-08-01), Nukii et al.

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