Etching a substrate: processes – Masking of a substrate using material resistant to an etchant – Mechanically forming pattern into a resist
Reexamination Certificate
2005-01-11
2005-01-11
Vinh, Lan (Department: 1765)
Etching a substrate: processes
Masking of a substrate using material resistant to an etchant
Mechanically forming pattern into a resist
C216S041000, C216S048000, C216S062000, C438S706000
Reexamination Certificate
active
06841082
ABSTRACT:
A method of manufacturing Er-doped silicon nano-dot arrays and a laser ablation apparatus are provided. In the method, a target having a silicon region and an erbium region is prepared. A silicon substrate is introduced opposite to the target. Laser light is irradiated onto the target, a plume containing silicon ablated from the silicon region and erbium ablated from the erbium region is generated, and an Er-doped silicon film is deposited on the silicon substrate from the plume. The Er-doped silicon film is patterned.
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Ha Jeong-sook
Park Jong-hyurk
Park Kyoung-wan
Park Seung-min
Blakely & Sokoloff, Taylor & Zafman
Electronics and Telecommunications Research Institute
Vinh Lan
LandOfFree
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