Method of manufacturing electronic component mounting body,...

Details Method of manufacturing electronic component mounting body,... Method of manufacturing electronic component mounting body,...

2005-04-04

2008-09-09

Lorengo, Jerry (Department: 1793)

Semiconductor device manufacturing: process

Coating with electrically or thermally conductive material

To form ohmic contact to semiconductive material

C257S737000

Reexamination Certificate

active

07422974

ABSTRACT:
A method of manufacturing an electronic component mounting body is used for mounting an IC chip having a bumps as an external mounting terminal on a base material made of thermoplastic resin, comprising: a bump burying step of burying the bumps into the base material by heating and pressing the IC chip toward the base material to expose a portion of the bumps to a base material surface on the opposite side of the IC chip, and a step of forming a conductor conductively connected to the bump by arranging conductive material on the base material surface to which the portion of the bumps are exposed.

REFERENCES:
patent: 6236112 (2001-05-01), Horiuchi et al.
patent: 2002/0063332 (2002-05-01), Yamaguchi et al.
patent: 2005/0067635 (2005-03-01), Saito
patent: 08-111574 (1996-04-01), None
patent: 2001-093934 (2001-04-01), None
patent: 2003-124259 (2003-04-01), None
patent: 2003-324126 (2003-11-01), None
Communication from Japanese Patent Office regarding related application.

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