Method of manufacturing electric device

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Including contaminant removal or mitigation

Reexamination Certificate

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C257SE21499

Reexamination Certificate

active

10960168

ABSTRACT:
In a method of manufacturing an electric device, moisture in a film substrate is reduced by heating the film substrate at a temperature in the range of 80° C. to 100° C. Thereafter, an IC is mounted on the film substrate.

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patent: 6146503 (2000-11-01), Sindzingre et al.
patent: 6261866 (2001-07-01), Marinis et al.
patent: 6318621 (2001-11-01), Marinis et al.
patent: 6383842 (2002-05-01), Takashima et al.
patent: 6468833 (2002-10-01), Uner et al.
patent: 6551860 (2003-04-01), Uner et al.

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