Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Including contaminant removal or mitigation
Reexamination Certificate
2007-12-04
2007-12-04
Zarneke, David A. (Department: 2891)
Semiconductor device manufacturing: process
Packaging or treatment of packaged semiconductor
Including contaminant removal or mitigation
C257SE21499
Reexamination Certificate
active
10960168
ABSTRACT:
In a method of manufacturing an electric device, moisture in a film substrate is reduced by heating the film substrate at a temperature in the range of 80° C. to 100° C. Thereafter, an IC is mounted on the film substrate.
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Adachi Hideaki
Hayashi Keiichiro
Koizumi Nobukazu
Matsuhira Tsutomu
Nishigawa Tadahiro
Adams & Wilks
Maruwa Corporation
Seiko Instruments Inc
Toray Advanced Film Co., Ltd.
Zarneke David A.
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