Adhesive bonding and miscellaneous chemical manufacture – Delaminating processes adapted for specified product – Delaminating in preparation for post processing recycling step
Patent
1991-02-19
1992-03-03
Powell, William A.
Adhesive bonding and miscellaneous chemical manufacture
Delaminating processes adapted for specified product
Delaminating in preparation for post processing recycling step
156656, 156902, 156643, 156640, 1566611, C23F 102, B44C 122
Patent
active
050929585
ABSTRACT:
Disclosed is a method of manufacturing a double-sided wiring substrate wherein wiring patterns having a low resistivity are formed on both surfaces of a substrate. A fine pin hole is formed in a thin insulating film having excellent durability by a pin or laser beams. A thin metal film is formed on the upper and lower surfaces of the insulating film and the inner wall of the fine pin hole by vacuum deposition. A thick metal film is formed on the entire thin metal film by electroplating. Thereafter, portions of the thin and the thick metal films formed on the upper and lower surfaces of the insulating film are etched while leaving a portion of them on the inner wall of the fine pin hole. Conductive patterns each having a layered structure of the thin and the thick metal films are thus formed on the upper and lower surfaces of the substrate. The "roll-to-roll system" that is, every step of manufacturing is performed by unrolling and feeding the insulating film rolled up around the roll, can also be applied. This enables to make the productivity extremely efficient.
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Kawamura Yoshihiro
Yarita Yoshio
Casio Computer Co. Ltd.
Powell William A.
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