Method of manufacturing die for embossing circuit pattern

Details Method of manufacturing die for embossing circuit pattern Method of manufacturing die for embossing circuit pattern

1977-04-27

1979-01-23

Powell, William A.

Adhesive bonding and miscellaneous chemical manufacture

Delaminating processes adapted for specified product

Delaminating in preparation for post processing recycling step

96 36, 101 28, 156905, C23F 102, C23C 100, C03C 1500, C03C 2506

Patent

active

041359640

ABSTRACT:
A method of manufacturing a die for embossing a desired circuit pattern of a metal foil onto a substrate comprises steps of forming, on the work surface of die material, a first circuit-coating pattern corresponding to the contour of the desired circuit pattern and a second circuit-coating pattern large enough to cover the first circuit-coating pattern and larger than the desired circuit pattern. The die material surface uncovered by the second circuit-coating pattern is partly etched away to leave a grooving for receiving the embossed metal foil. Then, the second circuit-coating pattern is stripped away, and the uncovered metal portion surrounded by the first circuit-coating pattern is suitably removed, and finally the first coating pattern is stripped away.

REFERENCES:
patent: 4053348 (1977-10-01), Weglin

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