Semiconductor device manufacturing: process – Making device or circuit emissive of nonelectrical signal – Packaging or treatment of packaged semiconductor
Reexamination Certificate
2006-10-31
2009-06-16
Zarneke, David A (Department: 2891)
Semiconductor device manufacturing: process
Making device or circuit emissive of nonelectrical signal
Packaging or treatment of packaged semiconductor
C438S025000, C438S117000, C438S126000, C257SE21502
Reexamination Certificate
active
07547564
ABSTRACT:
The present invention relates to a method of manufacturing a device having a flexible substrate and a device having a flexible substrate manufactured using the method.According to the method of manufacturing a device having a flexible substrate of the invention, glass is used as a mother substrate, a polymer layer, which is used as a substrate, is formed on the mother substrate using a chemical vapor deposition method or a vacuum evaporation method, a device is formed, and finally, the substrate where the device is formed is separated from the mother substrate, such that a large-scale device having a flexible substrate can be manufactured. Further, as a substrate forming an organic light emitting device and a sealant are formed of the same material, the device is not bent due to stress generated from the device itself after the device is manufactured.
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Lee Jae Seung
Lee Young Chul
Noh Jeoung Kwen
LG Chem. Ltd.
McKenna Long & Aldridge LLP
Zarneke David A
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