Plastic and nonmetallic article shaping or treating: processes – With severing – removing material from preform mechanically,... – Making hole or aperture in article
Patent
1990-04-17
1991-10-22
Lorin, Hubert C.
Plastic and nonmetallic article shaping or treating: processes
With severing, removing material from preform mechanically,...
Making hole or aperture in article
264248, 264254, 264255, 264261, 264263, 26427214, 26427215, 26427217, 264273, 264274, 264279, B29C 6570, B29C 4514
Patent
active
050593730
ABSTRACT:
A method of manufacturing a strip for carrying a plurality of small size electronic parts such as LED's enclosed hermetically in resin includes the formation of a grid-like conductor strip member by interconnecting lead wires for the electronic parts in a grid-like pattern. The conductor strip member is molded integrally with a strip segment in which the plurality of electronic parts are mutually connected by a runner member. A connecting portion is formed integrally at least at one end of the strip segment at a predetermined position such that while connecting the connecting portion of a first plastic strip segment with one end of a second plastic strip segment, wherein the predetermined position of the connecting portion is such that the distance between the preassigned mount locations for the small size electronic devices positioned on both sides of the connecting portion coincides with the predetermined pitch. While connecting together continuously a number of the strip segments by means of the connecting portions through repetitive cycles of molding operation, the electronic part carrying strip of any desired length up to a semi-endless length can be manufactured.
REFERENCES:
patent: 3914786 (1975-10-01), Grossi
patent: 4345889 (1982-08-01), Sizemore et al.
patent: 4466692 (1984-08-01), Sonoda
patent: 4486364 (1984-12-01), Takahashi
patent: 4697784 (1987-10-01), Schmid
Patent Abstract of Japan, vol. 9, No. 266 (E-352), 1989, 23rd Oct. 1985, JP-A-60 111 481 (Toshiba KK) 6/17/85.
Patent Abstract of Japan, vol. 8, No. 36 (E-277, 1473, 16 Feb. 1984, JP-A-58 194 382 (Matsushita Denki Sangyo K.K.) 11/12/83.
IDEC Izumi Corporation
Lorin Hubert C.
Ortiz Angela
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