Method of manufacturing conductive electrodes for a circuit elem

Adhesive bonding and miscellaneous chemical manufacture – Delaminating processes adapted for specified product – Delaminating in preparation for post processing recycling step

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156657, 1566591, 357 67, 357 71, 437189, 437201, 437235, B44C 122, C03C 1500, C03C 2506

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047494425

ABSTRACT:
In the method according to the invention conductive electrodes are provided with the aid of a mask aligned with respect to at least two contact windows present in an insulating layer. First, layers of metal combining with semiconductor material, for example, Pt silicide, are provided in the contact windows. A narrow region of the insulating layer between the two contact windows may have a reduced dimension because in their extreme relative positions the conductive electrodes can only partially cover the contact windows. The invention also relates to semiconductor devices comprising logic (or low-noise) transistors, or transistors for very high frequencies whose structure is improved with respect to their dimensions, their series resistance value and/or their gain.

REFERENCES:
patent: 3421985 (1969-01-01), Baker et al.
patent: 4164461 (1979-08-01), Schilling
patent: 4436582 (1984-03-01), Saxena

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