Method of manufacturing chip-on-chip semiconductor device

Details Method of manufacturing chip-on-chip semiconductor device Method of manufacturing chip-on-chip semiconductor device

2008-10-16

2010-12-14

Smith, Matthew S (Department: 2823)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Assembly of plural semiconductive substrates each possessing...

C438S109000, C438S612000, C438S613000, C257S777000, C257SE29169, C257SE23142

Reexamination Certificate

active

07851256

ABSTRACT:
Provided is a method of fabricating a chip-on-chip (COC) semiconductor device. The method of fabricating a chip-on-chip (COC) semiconductor device may include preparing a first semiconductor device with a metal wiring having at least one discontinuous spot formed therein, preparing a second semiconductor device with at least one bump formed on a surface of the second semiconductor device corresponding to the at least one discontinuous spot, aligning the first semiconductor device onto the second semiconductor device, and connecting the at least one bump of the second semiconductor device to the at least one discontinuous spot formed in the metal wiring of the first semiconductor device.

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