Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material
Reexamination Certificate
2005-03-15
2005-03-15
Smith, Matthew (Department: 2825)
Semiconductor device manufacturing: process
Coating with electrically or thermally conductive material
To form ohmic contact to semiconductive material
C336S223000, C257S531000
Reexamination Certificate
active
06867133
ABSTRACT:
Method of manufacturing a chip inductor including the steps of, a conductive layer forming process for forming conductive layer4on an outer periphery2and end surfaces3of a substrate1, a coil portion forming process for forming coil portion7having conductor5and groove6by cutting spirally the conductive layer4,an etching process for etching the substrate1having the coil portion7formed thereon; an insulation resin coating process for forming outer coating8by coating a surface of the conductive layer4with insulation resin13;and an electrode forming process for forming electrodes9at both ends of the coil portion7,and for making electric contacts between electrodes9and the conductive layer4.A chip inductor having a flattened mounting surface of the outer coating is obtained when insulation resin layer8is formed by an electrodeposition method in the insulation resin coating process. The chip inductor can be securely mounted to a circuit board.
REFERENCES:
patent: 5441783 (1995-08-01), Silgailis et al.
patent: 6084500 (2000-07-01), Kanetaka et al.
patent: 6388550 (2002-05-01), Kanetaka et al.
patent: 62-286211 (1987-12-01), None
patent: 6-96952 (1994-04-01), None
patent: 8-78290 (1996-03-01), None
patent: 10-125533 (1998-05-01), None
patent: 11-3820 (1999-01-01), None
patent: 11-260647 (1999-09-01), None
patent: 2000-30952 (2000-01-01), None
patent: 2000-58336 (2000-02-01), None
patent: 2000-64094 (2000-02-01), None
Fujimori Akira
Kanetaka Toyonori
Nakayama Hideaki
Taoka Mikio
Yamada Ken'ichi
Lee Calvin
McDermott Will & Emery LLP
Smith Matthew
LandOfFree
Method of manufacturing chip inductor does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Method of manufacturing chip inductor, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method of manufacturing chip inductor will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-3447539