Adhesive bonding and miscellaneous chemical manufacture – Delaminating processes adapted for specified product – Delaminating in preparation for post processing recycling step
Patent
1991-10-04
1993-08-31
Powell, William A.
Adhesive bonding and miscellaneous chemical manufacture
Delaminating processes adapted for specified product
Delaminating in preparation for post processing recycling step
156634, 156651, 156656, 156666, 156901, 428209, 428901, C23F 100, B44C 122
Patent
active
052405516
ABSTRACT:
A ceramics circuit board is manufactured by preliminarily preparing a circuit pattern base composed of a plurality of circuit pattern elements connected by bridging pieces each having a thickness smaller than that of the circuit pattern element, preferably less than half thickness of the circuit pattern base, applying and bonding the circuit pattern base onto one surface of a ceramics board base and removing the bridging pieces by effecting an etching treatment to thereby form a circuit pattern having a predetermined shape on the one surface of the ceramics board base. The circuit pattern base and the bridging pieces are formed of one metallic plate by partially effecting etching treatment. The bridging pieces are arranged so as to have a gap between a rear surface thereof and the one surface of the ceramics board base when the circuit pattern base is applied on the one surface of the ceramics board base. The bonding step may be carried out by forming, on a surface to be bonded, an eutectic material composed of the same metallic material as that composing the circuit pattern base and oxygen. It is preferred that the method further includes the step of applying and bonding a copper plate to another surface of the ceramics board base before the etching treatment.
REFERENCES:
patent: 3138503 (1964-06-01), Taraud
patent: 3264152 (1966-08-01), Haydon
patent: 4540462 (1985-09-01), Mizunoya et al.
Matsumura Kazuo
Tanaka Tadashi
Tsurutani Shoji
Kabushiki Kaisha Toshiba
Powell William A.
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