Adhesive bonding and miscellaneous chemical manufacture – Delaminating processes adapted for specified product – Delaminating in preparation for post processing recycling step
Patent
1990-09-10
1991-05-28
Powell, William A.
Adhesive bonding and miscellaneous chemical manufacture
Delaminating processes adapted for specified product
Delaminating in preparation for post processing recycling step
29827, 156634, 156645, 156656, 1566611, 156902, 437220, C23F 102, B44C 122, C03C 1500, C03C 2506
Patent
active
050192094
ABSTRACT:
A carrier tape has a plurality of rows.times.a plurality of columns of IC device holes and two pairs of sprocket holes. A plurality of finger leads extending into each IC device hole and a conductive lead for connecting all of the finger leads are formed on the carrier tape. While the carrier tape is conveyed with feed teeth of a sprocket being meshed with one pair of sprocket holes, the finger leads and the conductive leads are formed, and solder is plating on both of the leads. Only in a bonding step, the carrier tape is conveyed with the feed teeth of the sprocket being meshed with the other pair of sprocket holes. Since the sprocket holes used in the bonding step are not deformed, highly precise positioning of IC devices required in bonding can be efficiently achieved. Positioning holes are formed in the carrier tape at intervals corresponding to a plurality of columns of IC device holes, and each processing can be performed for a carrier tape portion between the positioning holes in units of a plurality of columns. The carrier tape can be manufactured with very high efficiency.
REFERENCES:
patent: 3689991 (1972-09-01), Aird
patent: 3968563 (1976-07-01), Hamlin
patent: 4049903 (1977-09-01), Kobler
patent: 4551912 (1985-11-01), Marks
patent: 4558581 (1985-12-01), Goulstone
patent: 4763409 (1988-08-01), Takekawa et al.
patent: 4801997 (1989-01-01), Ono
Hiraide Takashi
Kusunoki Ituro
Tajima Joji
Casio Computer Co. Ltd.
Powell William A.
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