Method of manufacturing and testing a semiconductor device

Details Method of manufacturing and testing a semiconductor device Method of manufacturing and testing a semiconductor device

2005-12-06

2005-12-06

Pert, Evan (Department: 2826)

Semiconductor device manufacturing: process

With measuring or testing

Electrical characteristic sensed

C438S464000

Reexamination Certificate

active

06972202

ABSTRACT:
A method of testing a semiconductor device includes the steps of: positioning on a surface of a test jig a semiconductor wafer provided with the semiconductor device; dividing the semiconductor wafer into a plurality of semiconductor chips on the surface by dicing the semiconductor wafer; and, with the plurality of semiconductor chips positioned on the surface, testing an electrical characteristic of semiconductor device.Consequently, a method of testing a semiconductor device which can test an electrical characteristic with higher accuracy prior to an assembling step, can be provided.

REFERENCES:
patent: 3766638 (1973-10-01), Moore
patent: 5389182 (1995-02-01), Mignardi
patent: 6713366 (2004-03-01), Mong et al.
patent: 6768332 (2004-07-01), Lin et al.
patent: 6-5668 (1994-01-01), None
patent: 7-74131 (1995-03-01), None
IBM Technical Disclosure Bulletin NN71053652 entitled “Chip testing and Sorting,” May 1971.

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