Method of manufacturing an electronic part having an air-bridge

Details Method of manufacturing an electronic part having an air-bridge Method of manufacturing an electronic part having an air-bridge

1997-05-06

2000-05-09

Everhart, Caridad

Semiconductor device manufacturing: process

Coating with electrically or thermally conductive material

To form ohmic contact to semiconductive material

438671, H01L 21445

Patent

active

06060381&

ABSTRACT:
An electronic part having an air-bridge interconnection has a flat air-bridge interconnection body, no interconnection loss, high Q and low power consumption. Also disclosed is a method of manufacturing such electronic parts. The flat air-bridge interconnection body is obtained by conducting two-stage selective plating including selective plating for forming posts on post base electrodes and selective plating for forming the air-bridge interconnection body.

REFERENCES:
patent: 4308090 (1981-12-01), Te Velde et al.
patent: 5148260 (1992-09-01), Inoue et al.
patent: 5171713 (1992-12-01), Matthews
patent: 5219713 (1993-06-01), Robinson
patent: 5408742 (1995-04-01), Zaidel et al.
IBM Tech. Discl. Bull. vol. 32 No. 8A (Jan. 1990) pp. 88-89.

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