Semiconductor device manufacturing: process – Semiconductor substrate dicing – Having specified scribe region structure
Reexamination Certificate
2006-04-04
2006-04-04
Fourson, George (Department: 2823)
Semiconductor device manufacturing: process
Semiconductor substrate dicing
Having specified scribe region structure
C438S401000, C438S975000
Reexamination Certificate
active
07022588
ABSTRACT:
The invention relates to a method of manufacturing an electronic component (1), in particular a semiconductor component (1), which is provided with electric connection regions (2), wherein a mark (M), such as a type number, is provided on a surface thereof by means of laser radiation (3).In a method according to the invention, the component (1) is attached with one (4) of its sides (4, 7) to a foil (5) by means of an adhesive layer (6), and the component is provided, on said side (4), with the mark (M) through the foil (5) and the adhesive layer (6). In this manner, a large number of components (1) can be readily provided with a mark (M) without undue handling, and the marking operation can be readily integrated in the complete manufacturing process of the components. Surprisingly it has been found that marking through a radiation-absorbing double layer (5, 6) is very well feasible. The component (1) can be attached to the foil (6) without contact between the electric connection region (2) and the adhesive layer. Preferably, a large number of components (1) are manufactured simultaneously and within a single body (10) that is attached to the foil (5). After the provision of the mark (M), the components (1) are separated from each other.
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Bosman Johan
Groenhuis Roelf Anco Jacob
Van De Water Peter Wilhelmus Maria
Fourson George
García Joannie Adelle
Koninklijke Philips Electronics , N.V.
Zawilski Peter
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