Etching a substrate: processes – Forming or treating electrical conductor article
Reexamination Certificate
2005-06-07
2008-03-25
Deo, Duy-Vu N. (Department: 1765)
Etching a substrate: processes
Forming or treating electrical conductor article
C216S009000, C216S095000, C216S041000
Reexamination Certificate
active
07347949
ABSTRACT:
A method of manufacturing a wiring board by utilizing electro plating characterized in that: when a wiring pattern is formed on the board by utilizing electro plating, an unnecessary portion does not remain on the wiring pattern. The method comprises: first electroless plating layers (19) are formed on both sides of an insulating substrate (1), which are covered with metallic foils (17) in advance, on which first electro plating layers (21) are formed; wiring patterns are formed by etching so as not to extend to the end edge of the substrate; second electroless plating layers (41) are formed on all of the surfaces of the substrate; a plating resist pattern (43) is formed so that only a predetermined portion of the wiring patterns is exposed; a second electro plating layer (27, 29) is formed on the predetermined portion of the wiring patterns by supplying an electric power from the second electroless plating layers; the plating resist pattern and the second electroless plating layers are removed; and a solder resist (45) is formed so that predetermined portions of the wiring patterns are exposed.
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Karasawa Takaaki
Miyagawa Hiroshi
Wakabayashi Hideyuki
Dahimene Mahmoud
Deo Duy-Vu N.
Shinko Electric Industries Co. Ltd.
Staas & Halsey , LLP
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