Method of manufacturing a wafer including providing...

Details Method of manufacturing a wafer including providing... Method of manufacturing a wafer including providing...

2011-07-05

2011-07-05

Huynh, Andy (Department: 2818)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Assembly of plural semiconductive substrates each possessing...

C438S113000, C438S460000, C257S784000, C257SE21499, C257SE21599

Reexamination Certificate

active

07972902

ABSTRACT:
Conductive lines are formed on a wafer containing multiple circuits. The conductive lines are isolated from the circuits formed within the wafer. Chips are mounted on the wafer and have their chip pads connected to the conductive lines of the wafer. The wafer may then be protected with a packaging resin and singulated.

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