Method of manufacturing a thick film resistor element

Details Method of manufacturing a thick film resistor element Method of manufacturing a thick film resistor element

1990-04-16

1992-12-08

Beck, Shrive

Adhesive bonding and miscellaneous chemical manufacture

Delaminating processes adapted for specified product

Delaminating in preparation for post processing recycling step

156656, 156901, 427102, 427307, C23C 2600

Patent

active

051694930

ABSTRACT:
A conductive paste layer of less than 5 .mu.m is formed on an insulating substrate. After a drying and a baking treatment of the conductive paste layer, an etching is carried out to form a plurality of electrode pairs. Resistor layers are formed corresponding to each pair of the electrodes so as to partially overlap with the electrodes.

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patent: 3366519 (1968-01-01), Pritchard
patent: 3699650 (1972-10-01), Cocca
patent: 4140817 (1979-02-01), Brown
patent: 4205392 (1980-05-01), Byrum, Jr.
patent: 4241103 (1980-12-01), Ohkubo
patent: 4316920 (1982-02-01), Brown
patent: 4503090 (1985-03-01), Brown
patent: 4539223 (1985-09-01), Hormadaly

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