Method of manufacturing a substrate with concave portions, a...

Etching a substrate: processes – Forming or treating optical article

Reexamination Certificate

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

C216S026000, C216S096000, C216S097000

Reexamination Certificate

active

10764606

ABSTRACT:
A method of manufacturing a substrate5with a plurality of concave portions3according to the invention includes the steps of forming a mask6on the substrate5, forming a plurality of initial holes61on the mask6by means of a physical method such as blast processing or irradiation with laser beams, and forming the plurality of concave portions in the substrate5by subjecting the mask6with the plurality of initial holes61to an etching process. In case of carrying out the blast processing, glass beads whose average diameter is in the range of 50 to 100 μm are used as blast media.

REFERENCES:
patent: 4012263 (1977-03-01), Shell
patent: 5593528 (1997-01-01), Dings et al.
patent: 5876267 (1999-03-01), Kanda
patent: 6407866 (2002-06-01), Yamashita et al.
patent: 6469832 (2002-10-01), Yotsuya et al.
patent: 6618200 (2003-09-01), Shimizu et al.
patent: 2003/0007772 (2003-01-01), Borrelli et al.
patent: 2000-131506 (2000-05-01), None
patent: 2001-039737 (2001-02-01), None
patent: 2001-341210 (2001-12-01), None
Wolf et al., Silicon Processing for the VLSA Era, 1986, Lattice Press, vol. 1, pp. 532-533.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Method of manufacturing a substrate with concave portions, a... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method of manufacturing a substrate with concave portions, a..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method of manufacturing a substrate with concave portions, a... will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-3721067

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.