Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material
Reexamination Certificate
2005-03-22
2005-03-22
Lee, Eddie (Department: 2811)
Semiconductor device manufacturing: process
Coating with electrically or thermally conductive material
To form ohmic contact to semiconductive material
C438S241000, C438S258000, C438S618000, C438S620000, C438S637000, C438S622000, C438S238000, C438S386000, C438S399000, C438S250000, C438S239000, C257S296000
Reexamination Certificate
active
06869872
ABSTRACT:
The present invention discloses a semiconductor memory device having a bit line and a metal contact stud, wherein the metal contact stud is formed on a different layer from a layer on which the bit lines are formed.
REFERENCES:
patent: 6037216 (2000-03-01), Liu et al.
patent: 6150689 (2000-11-01), Narui et al.
patent: 6238971 (2001-05-01), Parekh et al.
F. Chau & Associates LLC
Im Junghwa M.
Lee Eddie
Samsung Electronics. Co. Ltd.
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