Method of manufacturing a semiconductor memory device having...

Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material

Reexamination Certificate

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C438S241000, C438S258000, C438S618000, C438S620000, C438S637000, C438S622000, C438S238000, C438S386000, C438S399000, C438S250000, C438S239000, C257S296000

Reexamination Certificate

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06869872

ABSTRACT:
The present invention discloses a semiconductor memory device having a bit line and a metal contact stud, wherein the metal contact stud is formed on a different layer from a layer on which the bit lines are formed.

REFERENCES:
patent: 6037216 (2000-03-01), Liu et al.
patent: 6150689 (2000-11-01), Narui et al.
patent: 6238971 (2001-05-01), Parekh et al.

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