Method of manufacturing a semiconductor integrated circuit...

Details Method of manufacturing a semiconductor integrated circuit... Method of manufacturing a semiconductor integrated circuit...

2008-01-13

2011-12-06

Richards, N Drew (Department: 2895)

Semiconductor device manufacturing: process

With measuring or testing

Electrical characteristic sensed

C438S014000, C438S015000, C438S016000, C438S017000, C257SE21530

Reexamination Certificate

active

08071399

ABSTRACT:
An object is to prevent a breakage of a membrane probe and a wafer to be tested in a probe testing using a membrane probe with styluses formed by a manufacturing technology for a semiconductor integrated circuit device. Measures are: obtaining an image of a region PCA within the surface of a wafer including a region OGA pressed by a pressing member, at the center of which a chip just after probe-tested is located, by an imaging means such as a camera; comparing an image of a normal chip obtained in advance and an image of all the chips within the region PCA; and judging thereby whether an abnormal shape is caused or not in all the chips within the region PCA.

REFERENCES:
patent: 5091692 (1992-02-01), Ohno et al.
patent: 2003/0218471 (2003-11-01), Chandhok et al.
patent: 2007/0164763 (2007-07-01), Park
patent: 2009/0303324 (2009-12-01), Greenhill et al.
patent: 2006-049599 (2006-02-01), None

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