Method of manufacturing a semiconductor device with...

Semiconductor device manufacturing: process – Making field effect device having pair of active regions... – Having schottky gate

Reexamination Certificate

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

C438S187000, C438S198000

Reexamination Certificate

active

07151019

ABSTRACT:
To reduce a current loss through a channel and improve electron mobility, a first semiconductor layer and a second semiconductor layer (sequentially formed on a semiconductor substrate) have different lattice properties. The first semiconductor layer and the second semiconductor layer may be etched to form a first semiconductor pattern. A third semiconductor layer having a lattice property substantially identical to that of the first semiconductor layer may be formed over the first semiconductor pattern. The third semiconductor layer may then be etched to form a second semiconductor pattern. A gate may be formed on the second semiconductor pattern. The contact surface between the second semiconductor pattern and the gate pattern may consequently increased to reduce a current loss. Further, the lattice properties may be changed to improve electron mobility of the semiconductor layers.

REFERENCES:
patent: 5879996 (1999-03-01), Forbes
patent: 6300182 (2001-10-01), Yu
patent: 6774390 (2004-08-01), Sugiyama et al.
patent: 6855990 (2005-02-01), Yeo et al.
patent: 6867428 (2005-03-01), Besser et al.
patent: 6921982 (2005-07-01), Joshi et al.
patent: 7064019 (2006-06-01), Fried et al.
patent: 7098477 (2006-08-01), Zhu et al.
patent: 7112832 (2006-09-01), Orlowski et al.
patent: 2004/0175853 (2004-09-01), Inoue et al.
patent: 2004/0217420 (2004-11-01), Yeo et al.
patent: 2005/0017377 (2005-01-01), Joshi et al.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Method of manufacturing a semiconductor device with... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method of manufacturing a semiconductor device with..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method of manufacturing a semiconductor device with... will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-3694276

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.