Method of manufacturing a semiconductor device using a rigid...

Details Method of manufacturing a semiconductor device using a rigid... Method of manufacturing a semiconductor device using a rigid...

2006-10-17

2006-10-17

Brewster, William M. (Department: 2823)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Assembly of plural semiconductive substrates each possessing...

C438S126000, C438S127000

Reexamination Certificate

active

07122402

ABSTRACT:
In a method of manufacturing a semiconductor device of the invention, a rigid substrate which supports one or more semiconductor elements on a surface of the substrate and is clamped between an upper mold and a lower mold of an encapsulation mold at a time of resin encapsulation is provided, so that a vent-end edge portion of the substrate corresponding to a vent end of the encapsulation mold has a thickness smaller than a thickness of other portions of the substrate. The substrate is disposed in the encapsulation mold, and resin is injected into a cavity between the upper mold and the substrate to encapsulate the semiconductor elements with the resin.

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patent: 6767767 (2004-07-01), Hayashida et al.
patent: 9-116050 (1997-05-01), None
patent: 09-116050 (1997-05-01), None
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patent: 2002-110718 (2002-04-01), None
patent: 2003-17625 (2003-01-01), None

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