Method of manufacturing a semiconductor device that uses a calib

Details Method of manufacturing a semiconductor device that uses a calib Method of manufacturing a semiconductor device that uses a calib

1997-05-02

2000-11-14

Gulakowski, Randy

Etching a substrate: processes

Etching of semiconductor material to produce an article...

216 55, 216 79, 216 80, 438 14, 438906, 134 13, 134902, H01L 21302

Patent

active

061465410

ABSTRACT:
A semiconductor wafer (11) having a dielectric layer (12) is used as a calibration standard (10) to calibrate thickness measuring equipment in a wafer processing or manufacturing area. The thickness of the dielectric layer (12) is maintained to a desired thickness by heating the calibration standard (10) to remove contaminants from the dielectric layer (12).

REFERENCES:
patent: 3969164 (1976-07-01), Cho et al.
patent: 4760437 (1988-07-01), Denker et al.
patent: 4886765 (1989-12-01), Chen et al.
patent: 4948937 (1990-08-01), Blank et al.
patent: 4999211 (1991-03-01), Duggan
patent: 5024968 (1991-06-01), Engelsberg
patent: 5178682 (1993-01-01), Tsukamoto et al.
patent: 5275687 (1994-01-01), Choquette et al.
patent: 5383018 (1995-01-01), Sadjadi
patent: 5534491 (1996-07-01), Nakamura et al.
patent: 5599464 (1997-02-01), Laird et al.
patent: 5611855 (1997-03-01), Wijaranakula
patent: 5638251 (1997-06-01), Goel et al.
patent: 5714036 (1998-02-01), Wong et al.
patent: 5786277 (1998-07-01), Yamamoto
patent: 5817581 (1998-10-01), Bayer et al.
patent: 5869405 (1999-02-01), Gonzalez et al.
patent: 5925421 (1999-07-01), Yamazaki et al.
patent: 5938854 (1999-08-01), Roth
patent: 5950071 (1999-09-01), Hammond et al.
patent: 5960255 (1999-09-01), Bartha et al.
patent: 5998305 (1999-12-01), Holmer et al.
patent: 6013980 (2000-01-01), Goel et al.
Zapka, W. et al, "Efficient pulsed laser removal of 0.2 um sized particles from a solid surface" Appl. Phys. Lett. 58 (20) 2217-2219, May 1991.

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