Adhesive bonding and miscellaneous chemical manufacture – Delaminating processes adapted for specified product – Delaminating in preparation for post processing recycling step
Patent
1994-02-14
1995-03-21
Hearn, Brian E.
Adhesive bonding and miscellaneous chemical manufacture
Delaminating processes adapted for specified product
Delaminating in preparation for post processing recycling step
437190, 437194, 437195, H01L 21306
Patent
active
053992350
ABSTRACT:
A method of manufacturing a semiconductor device whereby on a surface (1) of a semiconductor body (2) a layer comprising aluminum (3) is deposited, in which conductor tracks (4) are etched, between which then an insulating aluminum compound (6) is provided in that a layer of such a material (7) is deposited, which layer is then removed down to the conductor tracks (4) by a bulk reducing treatment, upon which an insulating layer (11) is deposited into which contact windows (13, 14) are etched down to the layer comprising aluminum (4) for local contacting of the conductor tracks (4). The conductor tracks (4) are provided with a top layer (8) before the deposition of the insulating aluminum compound, and the aluminum compound is removed again down to the top layer (8) after the deposition by means of a polishing treatment which is practically incapable of removing the top layer (8). Mutually insulated conductor tracks (4) can be made in this manner which are suitable for use in integrated circuits with a very high integration density (VLSI).
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Mutsaers Cornelis A.H.A.
Wolters Robertus A.M.
Biren Steven R.
Dang Trung
Hearn Brian E.
U.S. Philips Corporation
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