Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Assembly of plural semiconductive substrates each possessing...
Reexamination Certificate
2005-05-31
2005-05-31
Tran, Minh-Loan (Department: 2826)
Semiconductor device manufacturing: process
Packaging or treatment of packaged semiconductor
Assembly of plural semiconductive substrates each possessing...
C438S109000, C257S686000, C257S724000, C257S778000
Reexamination Certificate
active
06900074
ABSTRACT:
Described herein is a stacked package according to the present invention, wherein a plurality of tape carriers which seal semiconductor chips, are multilayered in upward and downward directions. In the stacked package, one ends of leads formed over the whole surfaces of each tape carrier are electrically connected to their corresponding connecting terminals of the semiconductor chip. Other ends of the leads are electrically connected to their corresponding through holes defined in the tape carrier. Connecting terminals common to the plurality of semiconductor chips are formed at the same places of the plurality of tape carriers and withdrawn to the same external connecting terminals through a plurality of mutually-penetrated through holes.
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Horiguchi Masashi
Kubo Masaharu
Michishita Satoshi
Miyamoto Toshio
Nishimura Asao
Mattingly Stanger & Malur, P.C.
Renesas Technology Corp.
Tran Minh-Loan
LandOfFree
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