Method of manufacturing a semiconductor device having an...

Details Method of manufacturing a semiconductor device having an... Method of manufacturing a semiconductor device having an...

2007-07-03

2007-07-03

Thai, Luan (Department: 2891)

Semiconductor device manufacturing: process

Semiconductor substrate dicing

Having specified scribe region structure

C438S401000, C438S975000, C257S797000, C257SE23179

Reexamination Certificate

active

10942828

ABSTRACT:
A method of manufacturing a semiconductor device includes providing a substrate and forming a projecting alignment mark. The substrate includes an insulating layer and a semiconductor layer on the insulating layer, and the substrate includes device areas and a scribe line area which surrounds the device area in the semiconductor layer. The projecting alignment mark is formed on the scribe line area.

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