Method of manufacturing a semiconductor device, having a pattern

Details Method of manufacturing a semiconductor device, having a pattern Method of manufacturing a semiconductor device, having a pattern

1976-10-26

1978-03-14

Powell, William A.

Adhesive bonding and miscellaneous chemical manufacture

Delaminating processes adapted for specified product

Delaminating in preparation for post processing recycling step

29580, 156656, 156659, C23F 102

Patent

active

040789632

ABSTRACT:
A method of manufacturing a device, preferably a semiconductor device, having a pattern of conductors provided on a substrate. According to the invention a pattern of conductors with very fine details can be obtained by providing the pattern in at least two parts and at least two steps, in which in each step an auxiliary layer is provided over the assembly which is patterned so as to correspond with the negative of the part of the pattern of conductors to be provided, after which a conductive layer is provided over the assembly and at least a part of the auxiliary layer with the part of the conductive layer present thereon is then removed.

REFERENCES:
patent: 3866310 (1975-02-01), Driver et al.

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