Method of manufacturing a semiconductor device having a cell...

Details Method of manufacturing a semiconductor device having a cell... Method of manufacturing a semiconductor device having a cell...

2006-12-26

2009-06-23

Monbleau, Davienne (Department: 2893)

Semiconductor device manufacturing: process

Coating with electrically or thermally conductive material

To form ohmic contact to semiconductive material

Reexamination Certificate

active

07550378

ABSTRACT:
A method for manufacturing a semiconductor device including providing a semiconductor substrate including a cell area formed with relatively high device element density and a scribe line area formed with a device element density lower than the device element density of the cell area. An insulating layer is deposited over the semiconductor substrate. The insulating layer is planarized through a chemical mechanical polishing (CMP) process including a first polishing step and a second polishing step having different removal rates with respect to the insulating layer formed over the cell area and the scribe area.

REFERENCES:
patent: 6232228 (2001-05-01), Kwag et al.
patent: 2005/0026439 (2005-02-01), Watanabe et al.

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