Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Insulative housing or support
Patent
1998-07-14
2000-09-05
Picardat, Kevin M.
Semiconductor device manufacturing: process
Packaging or treatment of packaged semiconductor
Insulative housing or support
438106, 438125, 438127, H01L 2144, H01L 2148, H01L 2150
Patent
active
061141925
ABSTRACT:
A semiconductor plastic package, more particularly a preferred package structure and method for making a BGA package. A resin sealed BGA package where a supporting frame which fixedly supports semiconductor parts; i.e., an IC chip, a circuit board, or a circuit film, is sealed with resin, using a mold which is composed of an upper mold half and a lower mold half with the lower mold half having a plurality of projections, one at a position corresponding to each of the external terminals. The mold has a divisional structure which has an air vent between the divisional elements thereof.
REFERENCES:
patent: 4891687 (1990-01-01), Mallik et al.
patent: 4899207 (1990-02-01), Hallowell et al.
patent: 5053855 (1991-10-01), Michii et al.
patent: 5148265 (1992-09-01), Khandros et al.
patent: 5216278 (1993-06-01), Lin et al.
patent: 5293072 (1994-03-01), Tsuji et al.
patent: 5294827 (1994-03-01), McShane
patent: 5332864 (1994-07-01), Liang et al.
patent: 5365106 (1994-11-01), Watanabe
patent: 5391916 (1995-02-01), Kohno et al.
patent: 5490324 (1996-02-01), Newman
patent: 5639695 (1997-06-01), Jones et al.
patent: 5693572 (1997-12-01), Bond et al.
patent: 5914531 (1999-06-01), Tsunoda et al.
Anjoh Ichiro
Eguchi Shuji
Honda Michiharu
Kitano Makoto
Nishi Kunihiko
Collins D. B.
Hitachi , Ltd.
Picardat Kevin M.
LandOfFree
Method of manufacturing a semiconductor device having a ball gri does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Method of manufacturing a semiconductor device having a ball gri, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method of manufacturing a semiconductor device having a ball gri will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-2211358