Method of manufacturing a semiconductor device

Details Method of manufacturing a semiconductor device Method of manufacturing a semiconductor device

1977-05-11

1979-01-30

Rutledge, L. Dewayne

Adhesive bonding and miscellaneous chemical manufacture

Delaminating processes adapted for specified product

Delaminating in preparation for post processing recycling step

29574, 148 15, 148175, 156610, 427 10, H01L 2166, G01N 2102

Patent

active

041371224

ABSTRACT:
The invention relates to a method of manufacturing a semiconductor device in which a compound consisting of at least two semiconductor materials and having an energy gap which is smaller than that of a substrate is deposited epitaxially on the substrate. According to the invention, the composition of the mixture is determined during the deposition by means of measurement of the thermal emission.

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patent: 3696262 (1972-10-01), Antypas
patent: 3745834 (1973-07-01), Veltze et al.
patent: 4018566 (1977-04-01), Zeuch et al.
patent: 4024291 (1977-05-01), Wilmanns

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