Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material
Patent
1997-06-27
2000-02-29
Everhart, Caridad
Semiconductor device manufacturing: process
Coating with electrically or thermally conductive material
To form ohmic contact to semiconductive material
438614, 438615, H01L 21445
Patent
active
060308907
ABSTRACT:
A semiconductor device including a semiconductor element having a plurality of pads, and a method of manufacturing the semiconductor device. The semiconductor element includes a plurality of wiring portions, each being conducted to one of the pads, which are formed on a pad-formed surface of the semiconductor element; and a plurality of bumps, each being formed at a specified position of one of the wiring portions. Accordingly, it is possible to solve an inconvenience due to a difference in linear expansion coefficient between the semiconductor element and a circuit board and ensure a sufficient reliability; and to sufficiently make full use of the effect of high mounting density by flip chip mounting at a low cost.
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Everhart Caridad
Sony Corporation
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