Method of manufacturing a semiconductor device

Adhesive bonding and miscellaneous chemical manufacture – Delaminating processes adapted for specified product – Delaminating in preparation for post processing recycling step

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156662, 252 792, 252 794, 357 16, H01L 21312

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active

040494888

ABSTRACT:
The invention relates to a method of manufacturing a semiconductor device in which an etching process is used so as to etch regions consisting of A.sup.III B.sup.V compounds selectively relative to each other. According to the invention in the etching process an etching bath is used having a water-dissolved oxidizing material and a reducing material constituting together a redox system. In such an etching bath with redox system the selectivity is established by the choice of the concentrations of the materials and of the pH.

REFERENCES:
patent: 3772100 (1973-11-01), Masuda et al.
patent: 3801391 (1974-04-01), Dyment et al.
patent: 3833435 (1974-09-01), Logan et al.
patent: 3954534 (1976-05-01), Scifres et al.

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