Method of manufacturing a semiconductor device

Details Method of manufacturing a semiconductor device Method of manufacturing a semiconductor device

2004-12-03

2008-08-12

Malsawma, Lex (Department: 2892)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Metallic housing or support

C257SE21510

Reexamination Certificate

active

07410834

ABSTRACT:
A semiconductor device improved in packaging reliability is disclosed. Each of leads used in the semiconductor device has a first surface positioned between a main surface of a resin sealing body and a back surface opposite to the main surface of the resin sealing body, a second surface positioned on the side opposite to the first surface and exposed from the back surface of the resin sealing body, a first end face positioned on a semiconductor chip side, a second end face positioned on the side opposite to the first end face and exposed from a side face of the resin sealing body, and a recessed portion depressed from the second surface to the first surface side and contiguous to the second end face, the second surface and an inner wall surface of the recessed portion being covered with a plating layer which is higher in solder wettability than the second end face of each of the leads.

REFERENCES:
patent: 6452255 (2002-09-01), Bayan et al.
patent: 6608366 (2003-08-01), Fogelson et al.
patent: 2004/0058479 (2004-03-01), Matsuura et al.
patent: 2000-299400 (2000-10-01), None

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