4. Active solid-state devices (e.g., transistors, solid-state diode
  5. Lead frame
  6. With structure for mounting semiconductor chip to lead frame

Hajime Hasebe

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Method of manufacturing a semiconductor device

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Making plural separate devices
Reexamination Certificate

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Method of manufacturing a semiconductor device

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Metallic housing or support
Reexamination Certificate

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Semiconductor device

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Outside periphery of package having specified shape or...
Reexamination Certificate

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Semiconductor device

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Outside periphery of package having specified shape or...
Reexamination Certificate

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Semiconductor device and its manufacturing method with leads...

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With means for controlling lead tension
Reexamination Certificate

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Profile ID: LFUS-PAI-P-57295

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