Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Including adhesive bonding step
Reexamination Certificate
2007-08-28
2007-08-28
Toledo, Fernando L (Department: 2823)
Semiconductor device manufacturing: process
Packaging or treatment of packaged semiconductor
Including adhesive bonding step
C438S107000, C438S118000, C438S125000, C257SE21499, C257SE21510, C257SE21516
Reexamination Certificate
active
10754545
ABSTRACT:
Salient electrodes on a semiconductor chip and leads on a film substrate are to be connected together with a high accuracy. A change in lead pitch which occurs at the time of connecting salient electrodes on a semiconductor chip and inner leads on a film substrate with each other is taken into account and a correction is made beforehand to the pitch of the inner leads. Likewise, a change in lead pitch which occurs at the time of connecting electrodes on a liquid crystal substrate and outer leads on the film substrate with each other is taken into account and a correction is made beforehand to the pitch of the outer leads.
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Ichihara Seiichi
Kanamitsu Shinya
Tojo Shinji
Hitachi ULSI Systems Co. Ltd.
Jefferson Quovaunda
Miles & Stockbridge P.C.
Renesas Technology Corp.
Toledo Fernando L
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