Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material
Reexamination Certificate
2007-07-24
2007-07-24
Nguyen, Thanh (Department: 2813)
Semiconductor device manufacturing: process
Coating with electrically or thermally conductive material
To form ohmic contact to semiconductive material
C438S639000, C438S129000
Reexamination Certificate
active
10431385
ABSTRACT:
To ensure the connectability of wiring lines in a semiconductor device having terminals or reservoirs, plural terminals of a cell, which constitutes the semiconductor device, are each formed in a shape having a length corresponding to two or more lattice points. The terminals are arranged so that one or more lattice points are interposed between adjacent terminals. Among the terminals, as to terminals that are adjacent to each other in their shorter direction, it is allowable for them to partially overlap each other in their shorter direction. In this state, second-layer wiring lines are connected to the terminals via through holes, whereby reservoirs can be generated at the terminals, respectively.
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Ohayashi Masayuki
Yokoi Takashi
Antonelli, Terry Stout & Kraus, LLP.
Nguyen Thanh
Renesas Technology Corp.
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