Method of manufacturing a printed wiring board

Details Method of manufacturing a printed wiring board Method of manufacturing a printed wiring board

1992-10-13

1995-11-07

Kight, III, John

Radiation imagery chemistry: process, composition, or product th

Imaging affecting physical property of radiation sensitive...

Making electrical device

430313, 430314, G03C 500

Patent

active

054647258

ABSTRACT:
After pads 2 for mounting parts are formed at desired positions on an insulating board 1 in a circuit forming process using etching resist 3, the etching resist 3 is left on the pads without peeling it off. A first photosolder resist 4 is then formed between the pads 2, exposed to light, and developing using a solvent able to separate the etching resist 3 as a developing liquid, following which the etching resist 3 is peeled off together with the not yet fully hardened first photosolder resist 4. After formation of the first photosolder resist 4, a second photosolder resist is formed on desired areas excluding the interspaces between the pads 2, exposed to light, and developed. Consequently, when a photosolder resist is formed between pads pitched at narrow intervals on a printed wiring board, attachment of the photosolder resist to the pads due to misalignment between the insulating board and a photo-mask can be avoided.

REFERENCES:
patent: 4706167 (1987-11-01), Sullivan
patent: 4830704 (1989-05-01), Voss et al.

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