Method of manufacturing a printed circuit board

Radiation imagery chemistry: process – composition – or product th – Imaging affecting physical property of radiation sensitive... – Making electrical device

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430311, 430396, G03F 720

Patent

active

054947804

ABSTRACT:
In a method of manufacturing a printed circuit board, a photoresist layer is formed on a three-dimensionally molded substrate through a conductive layer. A planar photomask which is provided with a mask pattern and a light-transmissive pattern is placed in front of the photoresist layer. A parallel light beam is radiated to the photomask in order to give to the photoresist layer an exposed pattern of an intended width "L" in correspondence to the light-transmissive pattern. In the present invention, the light-transmissive pattern is configured so as to satisfy the following relations:

REFERENCES:
patent: 4904569 (1990-02-01), Fukuda et al.
patent: 5168624 (1992-12-01), Shirai

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