Method of manufacturing a printed circuit board

Details Method of manufacturing a printed circuit board Method of manufacturing a printed circuit board

1993-08-23

1994-12-27

Powell, William

Adhesive bonding and miscellaneous chemical manufacture

Delaminating processes adapted for specified product

Delaminating in preparation for post processing recycling step

156645, 156902, 427 97, B44C 122, C23F 100, B05D 512

Patent

active

053762320

ABSTRACT:
A method of depositing a conductive material on a surface of a printed circuit board, includes the steps of chemically treating at least a portion of a surface of the printed circuit board, disposing a resist layer over the chemically treated surface, depositing a conductive layer in the areas which are not covered by the resist, stripping the resist from the surface of the printed circuit board, and cleaning exposed chemically treated surfaces of the printed circuit board to remove contaminants from the surface of the printed circuit board which were introduced in the chemically treating step.

REFERENCES:
patent: 3006819 (1961-10-01), Wilson et al.
patent: 3832176 (1974-08-01), Verstraete et al.
patent: 3936575 (1976-02-01), Watanabe et al.
patent: 3962520 (1976-06-01), Watanabe et al.
patent: 4215387 (1980-07-01), Negishi
patent: 4311749 (1982-01-01), Hiraiwa et al.
patent: 4338149 (1982-07-01), Quascher
patent: 4556628 (1985-12-01), Grescher et al.
patent: 4582564 (1986-04-01), Shanfield et al.
patent: 4671968 (1987-06-01), Slominski
patent: 4774122 (1988-09-01), Adler
patent: 4781969 (1988-11-01), Kobaysashi et al.
patent: 4783247 (1988-11-01), Seibel
patent: 4800461 (1989-01-01), Dixon et al.
patent: 4897118 (1990-01-01), Ferrier
patent: 4897165 (1990-01-01), Bernards et al.
patent: 4932518 (1990-06-01), Bernards et al.
patent: 4958050 (1990-09-01), Oku et al.
patent: 4964945 (1990-10-01), Calhoun
patent: 4969979 (1990-11-01), Appelt et al.
patent: 5004525 (1991-04-01), Bernards et al.
patent: 5004639 (1991-04-01), Desai
patent: 5068013 (1991-11-01), Bernards et al.
patent: 5072074 (1991-12-01), DeMaso et al.
patent: 5084124 (1992-01-01), Taniguchi
patent: 5095628 (1992-03-01), McKenney et al.
patent: 5097390 (1992-03-01), Gerrie et al.
patent: 5100492 (1992-03-01), Kober et al.
patent: 5112694 (1992-05-01), Konotsune et al.
patent: 5121297 (1992-06-01), Haas
patent: 5142448 (1992-08-01), Kober et al.
patent: 5144534 (1992-09-01), Kober
patent: 5144742 (1992-09-01), Lucas et al.
patent: 5147208 (1992-09-01), Bachler
patent: 5153987 (1992-10-01), Takahashi et al.
patent: 5162140 (1992-11-01), Taniguchi
patent: 5172472 (1992-12-01), Linder et al.
patent: 5175047 (1992-12-01), McKenney et al.
patent: 5178318 (1993-01-01), Edwin et al.
patent: 5206463 (1993-04-01), DeMaso et al.
patent: 5213840 (1993-05-01), Retallick et al.
patent: 5214571 (1993-05-01), Dahlgren et al.

Affiliated with

Also associated with

Rating

Method of manufacturing a printed circuit board does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method of manufacturing a printed circuit board, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method of manufacturing a printed circuit board will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-916362