Semiconductor device manufacturing: process – Chemical etching – Combined with coating step
Reexamination Certificate
2010-09-13
2011-12-27
Nguyen, Cuong Q (Department: 2811)
Semiconductor device manufacturing: process
Chemical etching
Combined with coating step
C438S702000, C438S706000
Reexamination Certificate
active
08084365
ABSTRACT:
A method of manufacturing a nano structure by etching, using a substrate containing Si. A focused Ga ion or In ion beam is irradiated on the surface of the substrate containing Si. The Ga ions or the In ions are injected while sputtering away the surface of the substrate so that a layer containing Ga or In is formed on the surface of the substrate. Dry etching by a gas containing fluorine (F) is performed with the layer containing the Ga or the In formed on the surface of the substrate taken as an etching mask, and the nano structure is formed having a pattern of at least 2 μm tin in depth according to a predetermined line width.
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Aiba Toshiaki
Motoi Taiko
Okunuki Masahiko
Ono Haruhito
Tamamori Kenji
Canon Kabushiki Kaisha
Fitzpatrick ,Cella, Harper & Scinto
Nguyen Cuong Q
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