Chemistry: electrical and wave energy – Processes and products – Coating – forming or etching by sputtering
Reexamination Certificate
1999-05-27
2001-04-17
Nguyen, Nam (Department: 1753)
Chemistry: electrical and wave energy
Processes and products
Coating, forming or etching by sputtering
C204S192120, C204S192200, C204S192220
Reexamination Certificate
active
06217723
ABSTRACT:
BACKGROUND OF THE INVENTION
The invention relates to a method of manufacturing a multilayer film consisting of a stack of primary soft-magnetic layers and secondary non-magnetic layers on a substrate by way of reactive sputtering.
Reactive sputtering is a technique which has been known for a long time, in which a target is bombarded with ions from a plasma which is generated by inserting a gas into a vacuum reactor vessel in which a substrate on which a layer must be provided is placed opposite the target, and by applying a high voltage which is negative with respect to the wall of the reactor vessel to the cathode formed by the target. The ions are thereby accelerated towards the target where cascade collisions are generated which result in an exiting of target material atoms located close to the surface. The direction of the particles thus sputtered with respect to the normal on the target surface is mainly cosine-distributed. It is common practice to use an inert gas such as Ar (or possibly, for example, Kr or Xe) in the reactor vessel, although also an active gas such as N
2
, O
2
or CH
4
and the like may be used or added to the inert gas, dependent on specific applications.
This sputter-deposition technique is used, inter alia, for manufacturing multilayer films for magnetic heads. The multilayer film consists of a stack of primary soft-magnetic layers and secondary non-magnetic layers on a substrate. Particularly, the primary soft-magnetic layers have a thickness of the order of 0.1 to 10 &mgr;m and the secondary non-magnetic layers have a thickness of the order of 100 to 300 nm.
Examples of applying a soft-magnetic layer on a substrate by way of sputtering are given in, inter alia, U.S. Pat. No. 5,466,539. This patent states (in column 2, lines 64-67 and column 3, line 1) for example, a primary soft-magnetic layer which consists of an Fe
x
M
y
alloy, in which M is at least one element of the group comprising inter alia Nb, Zr, Hf, Ti, Ta, Si and x is an atom percentage of approximately 90% and y is an atom percentage of approximately 10%, which soft-magnetic layer is provided by means of a gas mixture consisting of Ar with approximately 3% of O
2
. The soft-magnetic layer mentioned in this U.S. patent has a thickness of 1.5 &mgr;m and is provided by way of sputtering with the aid of a plasma obtained from said gas mixture on a SiO
2
substrate which has a thickness of approximately 0.5 mm.
In the conventional manufacture of multilayer films for magnetic heads, sputtering techniques as described hereinbefore are used, in which the different composition of the primary soft-magnetic layer and the secondary non-magnetic layer is based on different targets. For example, it is known to use a CoZrNb target for the primary soft-magnetic layer and a ZrO
2
target for the non-magnetic layer. Thus, two targets having a different composition are used every time.
SUMMARY OF THE INVENTION
It is an object of the invention to improve the known method in this respect and provide the possibility of producing multilayer films at lower cost, particularly for magnetic heads.
In accordance with the invention, the method as described in the opening paragraph is therefore characterized in that use is made of one type of target at least as regards composition for alternately depositing a primary and a secondary layer. This means that either one target can be used for depositing both types of layers, or a plurality of targets having an identical or substantially identical composition can be used. In the latter case, use may be made of a known sputtering device for depositing the primary and secondary layers, in which device a plurality of targets is provided and in which a plurality of substrates is simultaneously provided with one of said layers.
Hitherto, these known sputtering devices have made use of targets which differ as far as composition is concerned, for example, a target consisting of an Fe alloy or the above-mentioned CoZrNb target for the soft-magnetic layers, and a target consisting of, for example ZrO
2
or SiO
2
for the non-magnetic layers. Since the substrates in these known sputtering devices are placed on a support which can be rotated underneath the relevant targets, a number of substrates can be alternately provided with soft-magnetic and non-magnetic layers in a continuous process. However, since the thickness of both types of layers varies quite considerably, the provision of notably a soft-magnetic layer will require much more time than the provision of a non-magnetic layer. After a non-magnetic layer has been deposited, a relatively long waiting time is thus to be observed, namely until also the soft-magnetic layer has been deposited, before the supports can be rotated underneath a different target where they can be sputtered with a layer having a different composition.
However, if all targets have the same composition, the support in the known sputtering device does not need to be rotated, and a number of substrates can be sputtered simultaneously in this device alternately with a soft-magnetic layer and a non-magnetic layer. For sputtering the alternate layers simultaneously, the composition of the gas mixture is then to be adapted synchronously; this will be elucidated hereinafter. By using only one type of target as far as composition is concerned, waiting times in the production of multilayer films can be prevented in the known sputtering device.
According to the invention, the target may be composed of an Fe
x
M
y
or a Co
x
M
y
alloy, in which M is at least one element selected from the group comprising Nb, Zr, Hf, Ti, Ta, and Si, and x is an atom percentage of at least 80.
It may be advantageous in the known sputtering devices to rotate the support in the case of parallel production of multilayer films in spite of the fact that all targets are identical. Since a certain inhomogeneous distribution is inherent in the sputtering process, the thickness of the layer to be provided may exhibit differences and variations. By rotating the support, such differences and variations in the layer thickness can be averaged.
REFERENCES:
patent: 4894133 (1990-01-01), Hedgcoth
patent: 5049209 (1991-09-01), Sakikima et al.
patent: 5429731 (1995-07-01), Osano et al.
patent: 5466539 (1995-11-01), Takayama
patent: 2098112A (1990-04-01), None
Vossen et al., “Thin Film Processes”, pp. 48-49, Dec. 1978.
Bloemen Pascal J. H.
Klaassens Wilco
Nguyen Nam
Treacy David R.
U.S. Philips Corporation
VerSteeg Steven H.
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