Method of manufacturing a light-emitting device

Adhesive bonding and miscellaneous chemical manufacture – Delaminating processes adapted for specified product – Delaminating in preparation for post processing recycling step

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156663, 437225, B44C 122, H01L 2100

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active

046922083

ABSTRACT:
On a support which supports a light-emitting semiconductor device there is arranged a cap which is hermetically sealed to the support. In the cap there is provided a transparent plate, an inner layer of which facing the semiconductor device consists of a material having a high refractive index (>1.7). On the outer side of the plate there is provided a layer of photosensitive lacquer which is exposed to the light emitted by the semiconductor device. After development of the layer of lacquer, only the exposed part which is situated opposite the semiconductor device remains. This part is heated to the melting point, thus forming a droplet of lacquer, after which the outer layer of the plate and the droplet of lacquer are removed by way of a non-selective etching method, so that a lens which is situated opposite the semiconductor device and a flat window which surrounds the lens are automatically formed at the same time.

REFERENCES:
patent: 3582300 (1971-06-01), Coombes et al.
patent: 3733258 (1973-05-01), Hanak et al.
patent: 3795557 (1974-03-01), Jacob
patent: 3806365 (1974-04-01), Jacob
patent: 3816847 (1974-06-01), Nagao
patent: 3839177 (1974-10-01), Dimigen
patent: 4366492 (1982-12-01), Kitamura
patent: 4403243 (1983-09-01), Hakamada
patent: 4505765 (1985-03-01), Trommer
Ephrath, "Journal of the Electro Chemical Society", vol. 126, No. 8, 8/79 pp. 1419-1421.

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