Method of manufacturing a custom corner attach heat sink design

Details Method of manufacturing a custom corner attach heat sink design Method of manufacturing a custom corner attach heat sink design

1999-01-05

2000-08-29

Nguyen, Tuan H.

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Metallic housing or support

438108, 257706, 257713, H01L 2144, H01L 2148, H01L 2150, H01L 2310, H01L 2334

Patent

active

06110762&

ABSTRACT:
An integrated circuit package. The package includes a substrate which has a first surface, a second opposite surface and four corners. Each corner has a conductive plane and at least one via. The vias connect the conductive planes of the first surface with corresponding conductive planes located on the second surface of the substrate. An integrated circuit is mounted to the first surface of the substrate and enclosed by plastic. Solder balls are attached to the conductive planes and a number of individual solder pads located on the second surface of the package. The contacts are connected to a printed circuit board. A lid is attached to the conductive planes at the four corners of the substrate. Some of the heat generated by the integrated circuit conducts through the substrate and into the printed circuit board. Some of the heat within the substrate conducts into the lid through the conductive planes located at the corners of the package. The present invention thus provides two thermal paths, the printed circuit board and the lid, from the substrate of a plastic integrated circuit package.

REFERENCES:
patent: 4814943 (1989-03-01), Okuaki
patent: 5367435 (1994-11-01), Andros
patent: 5483099 (1996-01-01), Natarajan
patent: 5510956 (1996-04-01), Suzuki
patent: 5552635 (1996-09-01), Kim
patent: 5898219 (1999-04-01), Barrow
patent: 5917702 (1999-06-01), Barrow

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