Method of manufacturing a circuit substrate and method of...

Details Method of manufacturing a circuit substrate and method of... Method of manufacturing a circuit substrate and method of...

2005-11-30

2008-10-14

Jackson, Jerome (Department: 2815)

Semiconductor device manufacturing: process

Coating with electrically or thermally conductive material

To form ohmic contact to semiconductive material

C438S584000, C438S612000, C438S613000, C438S652000

Reexamination Certificate

active

07435680

ABSTRACT:
A method of manufacturing a circuit substrate of the present invention, includes the steps of forming an n-layered (n is an integer of 1 or more) wiring layer connected electrically to a metal plate on the metal plate, forming an electroplating layer on a connection pad portion of an uppermost wiring layer of the n-layered wiring layer by an electroplating utilizing the metal plate and the wiring layer as a plating power-supply path, and removing the metal plate.

REFERENCES:
patent: 5173766 (1992-12-01), Long et al.
patent: 6662442 (2003-12-01), Matsui et al.
patent: 6670718 (2003-12-01), Chinda et al.
patent: 2002/0185744 (2002-12-01), Katagiri et al.
patent: 2003/0160325 (2003-08-01), Yoneda et al.
patent: 9-283925 (1997-10-01), None
patent: 2001-36238 (2001-02-01), None
patent: 2004-64082 (2004-02-01), None

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