Method of manufacture of a wiring board

Details Method of manufacture of a wiring board Method of manufacture of a wiring board

1988-01-29

1989-05-16

Powell, William A.

Adhesive bonding and miscellaneous chemical manufacture

Delaminating processes adapted for specified product

Delaminating in preparation for post processing recycling step

29846, 29852, 156630, 156634, 156645, 156656, 1566591, 156151, 156902, 427 97, 430313, 430318, B44C 122, C23F 102, C03C 1500, B29C 3700

Patent

active

048307041

ABSTRACT:
A multi-layered printing wiring board and a method for manufacture where the multi-layered printing wiring board has thermal expansion controlling copper invar copper core therein with portions of the invar core therein with portions of the invar being selectively removed and replaced with superior materials for plating conductive material there to and further having a reduced coefficient of thermal conductivity by providing for a noble metal layer to be selectively deposited on pre-determined positions on the copper invar copper core thereby selectively etching portions of the copper and invar up to the noble metal layer and thereby providing for selectively removing the invar and replacing it with a laminant material.

REFERENCES:
patent: 3514538 (1970-05-01), Chadwick et al.
patent: 4522667 (1985-06-01), Hanson et al.
"Constructing PWB's with Copper-Invar-Copper", by Louis J. Boccia, PC Fab, 7/86, New Board Overcomes TCE Problem, Electronic Packaging & Production, 11/86.

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