Method of manufacture interconnect device

Details Method of manufacture interconnect device Method of manufacture interconnect device

1989-05-15

1991-02-26

Powell, William A.

Adhesive bonding and miscellaneous chemical manufacture

Delaminating processes adapted for specified product

Delaminating in preparation for post processing recycling step

29827, 156633, 156634, 156643, 156644, 156656, 1566591, 156668, 156902, 156247, 1562728, 156289, 21912169, 21912171, 357 70, 428131, 428209, 428901, B44C 122, C23F 102, B29C 3700, C03C 1500

Patent

active

049959417

ABSTRACT:
An interconnect device for electronic components, such as integrated circuits, multichip modules and the like, and the method of manufacture thereof are presented. The interconnect device has two layers of circuitry, one for signal transmission and one for voltage plane. The interconnect device is made by a processing on a stainless steel carrier plate to achieve high lead count capability with fine line widths and spacing, as well as precise registration layer to layer. Laser drilling is used to define interconnect vias between signal and voltage (power or ground) plane layers.

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patent: 4642160 (1987-02-01), Burgess
patent: 4685998 (1987-08-01), Daniel et al.

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